Koh young Aspire 2 - #45621

SPI, Year 2015

REQ

Available

Description

3D solder paste measurement using Shadow Free Moire with 4-axis projection Measurement Range: Volume, Area, Height, Offset, Bridging, Shape Deformity Detectable Defects: Missing Paste, Excessive Paste, Insufficient Paste, Bridging, Shape Deformity, Paste Offset Measurement Accuracy: Less than or equal to 10 percent Gage R and R on 01005 pads PCB Size: Minimum 50 x 50 mm, Maximum 510 x 510 mm PCB Thickness: 0.4 mm to 5.0 mm Maximum PCB Weight: 2.0 kg Bottom Clearance: 30 mm Camera: 4 Megapixel Z-axis Resolution: 0.37 micrometers