Koh young KY3020T - #41103

SPI, Year 2014/05

REQ

Available

Description

Table Top 3D SPI Metrology Capability: Volumen Area, Height, Offset, Bridging and Shape Deformity Type of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste offset Measurement Principle: 3D Shadow free Moiré Camera: 1MPix 220V, 1Phase, 50-60hz, 0,8A, 0,88kW, weight 95kg, Machinedimensions:780 x 1100 x 734mm Max PCB size: 460 x 410mm Min PCB size: 50 x 50mm PCB Thickness: 0,4 - 4,0mm Max. PCB weight 2kg