Koh young aSPire - #41481

SPI, Year 2011

REQ

Available

Description

*Spare parts donor* 3D Solder Paste Inspection Machine Metrology Capability: Volumen Area, Height, Offset, Bridging and Shape Deformity Type of Defects: Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste offset Measurement Principle: 3D Shadow free Moiré Camera: 4MPix 220V, 1Phase, 50-60hz, 5A, 2,2kW, weight 600kg, Machinedimensions:1000 x 1230 x 2097mm Max PCB size: 510 x 110mm Min PCB size: 50 x 50mm PCB Thickness: 0,4 - 5,0mm Max. PCB weight 2kg