Koh young aSPire - #42102

SPI, Year 2008

REQ

Available

Description

*Spare parts donor* 3D solder paste inspection machine Metrology Capability: Volume Area, Height, Offset, Bridging, and Shape Deformation Type of defects: Insufficient/Excessive/Lack of Paste, Bridging, Shape Deformation, and Paste Offset Measuring principle: 3D shadow-free moiré Camera: 4MPix 220V, 1phase, 50-60Hz, 5A, 2.2kW, weight 600 kg, Machine dimensions: 1000 x 1230 x 2097 mm Maximum board size: 510 x 510 mm Min. PCB size: 50 x 50 mm Circuit Board Thickness: 0.4 - 5.0mm max. PCB weight 2kg